Alpha and Omega Semiconductor - XS Series MOSFET Packaging Technology - 25 October 2012

AOS sets new standard with XS Series MOSFET packaging technology.

Best-in-class performance and power density, critical for high efficiency server, telecom, data storage and motor control applications.

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Key Features

XSFET incorporates the packaging technology where the bottom of the package is the "source", which enables power designers to remove heat more effectively to PCB ground plane.
Features a large top heat slug which can be "top-exposed" or "non top-exposed" depending upon design criteria.
Top-exposed version delivers a significant increase in heat transfer, which helps to reduce power losses in a system by keeping the die cooler.
Offers standard lead-frame based board mounting in a fully encapsulated DFN molded package, minimizing the thermal discrepancy between the device and the PCB while offering near zero parasitic inductance.

Device Specification Table

Part Number	Package	Top Exposed	Vds	Vgs	Typ Rds(ON) @ 10V	Typ Rds(ON) @ 4.5V	Typ Qg @ 4.5V	Id @ TA = 25°C (A)	Id @ TA = 100°C (A)
AOE6770T	XS-5x6	Yes	25 V	±20 V	1.25 mOhm	1.95 mOhm	40 nC	145 A	90 A
AOE6772T	XS-5x6	Yes	25 V	±16 V	1.15 mOhm	1.6 mOhm	50 nC	145 A	90 A
AOE7770T	XS-3x3	Yes	30 V	±20 V	2.4 mOhm	3.4 mOhm	14 nC	76 A	48 A
AOE6580	XS-5x6	No	30 V	±20 V	0.78 mOhm	1.4 mOhm	34 nC	150 A	95 A
AOE6580T	XS-5x6	Yes	30 V	±20 V	0.78 mOhm	1.4 mOhm	34 nC	178 A	112 A

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