XSFET incorporates the packaging technology where the bottom of the package is the "source", which enables power designers to remove heat more effectively to PCB ground plane.
Features a large top heat slug which can be "top-exposed" or "non top-exposed" depending upon design criteria.
Top-exposed version delivers a significant increase in heat transfer, which helps to reduce power losses in a system by keeping the die cooler.
Offers standard lead-frame based board mounting in a fully encapsulated DFN molded package, minimizing the thermal discrepancy between the device and the PCB while offering near zero parasitic inductance.