Facebook   Follow ApexElecLtd on Twitter
Find part

   Login   Register


Internet banking

Alpha and Omega Semiconductor - AOC2403 Industry's 1st Molded Chip Scale Package - 10 October 2012

AOC2403 industry's first Molded Chip Scale Package.

MCSP a breakaway technological innovation for space-constrained portable devices.

  Product page  Datasheet

    Key Features
  • AOC2403 MCSP in a tiny 0.97mm x 0.97mm x 0.3mm power package, reduces height by 50%.
  • Ideal for the latest ultra-portable applications.
  • Easily replaces standard CSP by offering same footprint, pin-out, and pitch, with more benefits.
  • This innovative package, along with the low on-resistance AOS MOSFET technology, provides designers of ultra-portable systems with a compelling new power management solution.
  • AOC2403 is a 20V 95mOhm P-Channel MOSFET housed in a halogen-fee MCSP.

  • Device Specification Table
    Part NumberVds (V)Vgs (V)Rds (on) mΩ max
    @ 4.5V
    Rds (on) mΩ max
    @ 2.5V
    Rds (on) mΩ max
    @ 1.8V
    Rds (on) mΩ max
    @ 1.5V
    Qg (typ) (nC)Id @ TA = 25°C (A)

 Print results    Save results

Copyright © 2012 Apex Electronics Ltd New Zealand All Rights Reserved.